Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to ...

Austriamicrosystems (www.austriamicrosystems.com) has introduced its 50V CMOS high voltage (HV) process, a fully modular proprietary extension of the 0.35 mum CMOS technology that enables high ...

Newport Beach, CA—Jazz Semiconductor announced the availability of a 17-GHz vertical PNP (VPNP) module on its 0.18um RFCMOS platform. The addition of the VPNP module to its RFCMOS platform enables the ...

Designers of electronics and communications systems are constantly faced with the challenge of integrating greater functionality on less silicon area. Many of the system blocks – such as power ...

Two major semiconductor players have unwrapped plans to ramp up production in the 0.13-µm (130-nm) CMOS process. Combining innovations in copper wiring, silicon-on-insulator (SOI) transistors, and ...

Texas Instrument's Richard Zarr reviews the differences between Silicon-Germanium BiCMOS and small-geometry CMOS when it comes to driving high-speed data transmission lines. The CMOS process was the ...

Hsinchu, Taiwan, September 6, 2012 - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced a collaborative effort with ...

A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...