FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

The global electroplating market size is projected to reach $27.2 billion by 2032, growing at a CAGR of 4% from 2023 to 2032 WILMINGTON, DE, UNITED STATES, June 25, 2025 /EINPresswire / -- Allied ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...

VTT Technology Research Centre to use ClassOne Solstice S8 for advanced packaging This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer ...

In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an ...

Victory PCB, a professional printed circuit board manufacturer based in Shenzhen, today announced its continued focus on the production and supply of Heavy Copper Printed Circuit Boards (PCBs), ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...