The global electroplating market size is projected to reach $27.2 billion by 2032, growing at a CAGR of 4% from 2023 to 2032 WILMINGTON, DE, UNITED STATES, June 25, 2025 /EINPresswire / -- Allied ...
HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...
The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...
In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an ...
San Jose, California – March 17, 2010 – Novellus Systems (NASDAQ: NVLS) today announced the establishment of a joint development program (JDP) with the IBM Corporation (NYSE: IBM) to design a ...
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