As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process ...

Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three ...

MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...

A highly reliable nano-clustering silica (NCS) with low dielectric constant (k<2.3) and high elastic modulus (E=10Gpa) for copper damascene process has been developed by controlling the size and ...