DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/22f186/esd_design_and_sy) has announced the addition of John Wiley and Sons ...

Electrostatic discharge (ESD) is caused by the discharge of an excess or deficiency of electrons on one surface with respect to another surface or to ground. When a static charge is present on an ...

We’ve all experienced the effect of electrostatic discharge at some point in our lives, the most common case being a tingling sensation one feels after touching a door knob or any metal surface. When ...

AUSTIN, Texas--(BUSINESS WIRE)--The Silicon Integration Initiative Compact Model Coalition is proud to announce the release of the ASM-ESD diode model, a new electrostatic discharge compact modeling ...

Signal integrity and performance is critical for maintaining the quality of HDMI's GHz signals, as well as achieving compliance to the HDMI standard. Manufacturing requirements for ESD protection, ...

STATE COLLEGE, Pa., June 9, 2021 /PRNewswire/ — Remcom announces an update to XFdtd(R) 3D EM Simulation Software, with transient EM/circuit co-simulation for electrostatic discharge (ESD) testing and ...

MILPITAS, CA — Printed circuit board and multichip module design software revenue rose 3.4% in the September quarter, reaching $466 million, the ESD Alliance announced today. The four-quarter moving ...

We all have hands on experience with electrostatic discharge (ESD), even if it’s just from walking across a carpet and touching something metal, releasing static electricity buildup in one brief ...

San Jose, Calif. – May 10, 2010 – Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced PathFinder™, a ...

Standards for specifying a chip’s ability to withstand electrostatic discharge (ESD) are changing – in some cases, getting tougher, and in others, easing up. ESD protection has been on a path from a ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...