New process device profiles have been added by ODVA to the EtherNet/IP specification to provide end users with another tool to help optimize plant operations. According to ODVA, the new process device ...

CARLSBAD, Calif.--(BUSINESS WIRE)--Spinal Elements, a spine technology company, today announced the release of its Clutch interspinous process device. This new product further enhances the breadth of ...

BOSTON--(BUSINESS WIRE)--908 Devices Inc., (Nasdaq: MASS), a pioneer of purpose-built handheld and desktop devices for chemical and biochemical analysis, announced that National Resilience, Inc.

New process device profiles for temperature sensors have been made available for the EtherNet/IP specification to improve vendor interoperability and thus help system integrators and end users ...

Researchers are rolling out a new manufacturing process and chip design for silicon carbide (SiC) power devices, which can be used to more efficiently regulate power in technologies that use ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...