NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

RF Digital has released a fully FCC and CE-compliant 2.4GHz ULP wireless module in 15 by 15 by 3mm form factor powered by the nRF24LE1 ultra low power single chip transceiver, from wireless specialist ...

TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as ...

Chipmaker Broadcom Inc. today debuted four RF front-end modules for powering routers that use Wi-Fi 7, a new wireless networking standard. The company says its modules can also be used to build Wi-Fi ...

Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

Forbes contributors publish independent expert analyses and insights. I write about disruptive companies, technologies and usage models. Full 5G module digital and analog solution It takes thousands ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Heptagon (www.hptg.com), an industry leader in sensing, illumination and 3D imaging solutions for the Internet of Things (IoT) and Smart Devices, today announced ...