When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Siemens Digital Industries Software announced the latest updates to its NX and NX X software from the Designcenter suite of product engineering software, including immersive engineering for mixed ...

High-fidelity simulation is revolutionizing robotics by providing a safe, controlled virtual environment where developers can design, test, and refine robotic systems before real-world deployment.

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...