Whole-wafer failure analysis (FA) solution for advanced packaging and increasing adoption of scia Mill 200 and scia Cluster 200 platforms underscore scia Systems' leadership in ion beam and plasma ...

The MarketWatch News Department was not involved in the creation of this content. System Delivers Industry-Leading 350nm High-Resolution Imaging and Two-in-One Capabilities (Laminography and ...

Amrutha Sampath is an accomplished electrical failure analysis engineer based in Austin, Texas. With a strong educational foundation, including a Master of Science in Electrical Engineering from Texas ...

MOORESTOWN, N.J., Feb. 10, 2023 /PRNewswire/ -- Denton Vacuum LLC announced today that they have won a third order for the Infinity FA failure analysis system from a leading global semiconductor ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Matching a cleaning agent to the soil it cleans is key ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...