Silicon Semiconductor

Preventing liquid cross-contamination in semiconductor manufacturing

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
电子工程专辑

Wafer bonding及BSI工艺

BSI结构需要额外的waferbonding及thinning，背面对准处理（alignmentfor backside process）及背面界面钝化（passivation）等工艺，要求容差非常小，工艺复杂。下表是常用的两种BSI结构工艺，不论采用哪种BSI结构，都需要waferbonding工艺。 以SONY为代表的SOI结构，其成本提高4~5 ...
Nasdaq

Akoustis Locks Process Flow for First Wafer-Level-Chip-Scale Package (WLCSP) for XBAW Filters

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Semiconductor Engineering

New RDL-First PoP Fan-Out Wafer-Level Package Process With Chip-to-Wafer Bonding Technology

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Electronics Weekly

Imec develops die-to-wafer bond process with 2µm pad pitch

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Semiconductor Engineering

Inspecting Unpatterned Wafers

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...
Automation World

McCrometer: Wafer-Cone Flow Meter Meets European Pressure Equipment Directive Standards

To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...