You need the right tool to slice silicon blocks into paper-thin wafers: a several-kilometer-long wire wetted with a type of grinding paste. And all the parameters must be optimally adjusted -- only ...

Engineers have devised a new way to slice thin wafers of the chemical element germanium for use in the most efficient type of solar power cells. They say the new method should lower the cost of such ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

SALT LAKE CITY – University of Utah engineers devised a new way to slice thin wafers of the chemical element germanium for use in the most efficient type of solar power cells. They say the new method ...

Pune, Jan. 11, 2024 (GLOBE NEWSWIRE) -- The Global Silicon Carbide Ingot Slicing Machine Market refers to the industry that manufactures and sells machines used for slicing silicon carbide ingots, a ...

MJC Probe (MPI) has announced its board of directors recently approved plans to withdraw from the solar ingot slicing business, in which it began operations in mid-2007. The move... Wednesday 26 May ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

Engineers are working on flexible circuitry in hopes of developing wearable electronics or displays that can roll up. To achieve the high performance of silicon circuits in flexible devices, a few ...

A silicon wafer is a thin slice of crystalline silicon typically grown using the Czochralski process, which involves pulling a crystal seed from a molten silicon bath. A silicon wafer is a thin slice ...

According to the company, the wafer manufacturing capacity is being spun off from a subsidiary of Glory Silicon Technology Investments (Hong Kong) Limited, in which Suntech holds an equity investment.