As the industry accelerates toward 800G Ethernet and optical interconnects, engineers face new challenges in managing electromagnetic interference (EMI) while ensuring signal integrity at ...

Although GaN HEMTs offer superior performance over traditional silicon devices, they also introduce design challenges caused by high current transitions (di/dt), which can lead to significant spikes ...

Top Manufactures in Ball Grid Array (BGA) PCB Market research reports are as follow: Samsung Electro-Mechanics, Nanya PCB, TTM Technologies Inc., Unimicron, Shennan ...

Considerations for dividing analog and digital blocks. Decoupling techniques. Breaking down the board layers. How best to deal with grounding. Similar to building a house, it’s essential to create a ...

The reliability of a PCB and its respective components, such as an IC (integrated circuit) or a BGA (ball grid array), might differ depending on the design and selection of the semiconductor ...

Abstract: The dependency of the failure mechanisms of PCB/BGA assemblies subjected to drop impact on board designs variations is investigated in this study. Two key parameters are considered: the ...

This document is an application note of the Printed Circuit Board (PCB) layout techniques in operational amplifier precision design. It discusses the PCB effects experienced in high DC precision op ...

Abstract: In this work, the influence of the copper pad geometry on the reliability of printed circuit board/ball grid array (PCB/BGA) assemblies under drop impact is assessed. The method employed is ...