Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by Assembling Different Silicon Technologies at the Wafer Level, Allowing Dense Co-integration of ...

CEA-Leti and STMicroelectronics has presented results at IEDM 2025 showcasing key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive ...

Self-healing materials at RIT utilize stimuli-responsive resins that repair damage immediately as it occurs. The research mimics natural biological repair processes to improve the durability of ...

DroneScan3D attached to a drone, which is not included with the instrument. As more tower sites adopt drones for maintenance tasks, one amateur radio operator has designed a field strength instrument ...

Abstract: This work explores expanding the capabilities of large language models (LLMs) pretrained on text to generate 3D meshes within a unified model. This offers key advantages of (1) leveraging ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

In this blog, we will discuss how Keysight RF Circuit Simulation Professional revamps RF circuit simulation and optimization. Discover how to achieve efficient, accurate designs for even the most ...

It looks like sushi—but it’s 100% cake! In this fun and creative tutorial, watch how we transform simple ingredients into a realistic sushi cake using candy, frosting, and pure imagination. The result ...

Shannen Doherty remembered on 1-year anniversary of her death by Sarah Michelle Gellar and more Air India flight crash: Not easy to ‘accidentally’ cut off fuel switches, expert says Why Are So Many ...

Abstract: This paper presents a 3D model of a photoconductive antenna (PCA) on semiconductor substrate. The simulations were conducted using the COMSOL Multiphysics package. The model considers the ...

In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution – tackling one of the ...