HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...

LG Innotek announced on the 13th that it has signed a memorandum of understanding (MOU) with Gwangju Metropolitan City for ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

Abstract: This article presents a new transceiver configuration based on the low-noise power amplifier (LNPA) approach targeting the reduction in size and the overall biasing complexity. In such ...