SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, ...

Quectel Launches SP895BD-AP Smart Module, Powering the Next Generation of Intelligent IoT ApplicationsBusiness Wire via ITWeb,LAS VEGAS, 05 Jan 2026Quectel Wireless Solutions, an end-to-end global IoT ...

The BCM4918 is designed to be used with two new radio chips, BCM6714 and BCM6719, that Broadcom debuted in conjunction. A ...

At the heart of the announcement is the nRF54LM20B, an ultra‑low‑power wireless system‑on‑chip (SoC) that integrates Nordic’s ...

SK Hynix will showcase a lineup of next-generation high-bandwidth memory (HBM) products at CES2026 in Las Vegas, U.S., aiming ...

The new product is approximately 49% smaller than our previous product, the "LACNF2012KKT1R0MAB" (2.0 x 1.25 x 1.0 mm), and ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, is bringing AI intelligence and ...

HP is delivering a different kind of all-in-one with the EliteBoard G1a, featuring a unique 'cyberdeck'-like design.

The Redmi Note 15 is finally here, bringing an interesting set of features and specifications. Check out the first ...