Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Members can download this article in PDF format. Engineers have many options when designing power stages, from low-dropout (LDO) regulators to switching power supplies. The former provide low noise ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...