Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...

An international research team has developed a new two-dimensional perovskite interlayer based on a co-crystal engineering strategy for more robust perovskite films. It demonstrated improved ...

Through PowerShell Script modules (.psm1) which use the core framework Cmdlets. Interactive login using Username and Password. For terminal-only clients provide the parameter UseDeviceCode the login ...

Abstract: This study aims to explore the solder fatigue lifetime of a developed high-voltage (1.7 kV/100 A) SiC power MOSFET module for on-board chargers (OBCs) subjected to power cycling test (PCT) ...