Empower RF Systems has announced the release of its latest C-UAS RF amplifier module, Model 1211, engineered for robust ...

As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...

STMicroelectronics' latest STM32MP21 microprocessors target cost-sensitive edge applications such as smart factories, smart ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Envelope tracking (ET) power amplifiers and supply modulators represent a pivotal advance in modern radio frequency (RF) design, particularly for wireless communications. These systems dynamically ...

Abstract: This letter presents a 300-GHz-band power amplifier (PA) module implementing a PA integrated circuit (IC) fabricated in 250-nm indium phosphide (InP) double-heterojunction bipolar transistor ...

Modern SDRs evolve from configurable platforms into intelligent wideband sensing systems combining high dynamic range, ...

Abstract: This paper proposes a deep learning-powered method with transfer learning capability to accelerate RF active circuit design. A schematic-level surrogate model for broadband matching is ...

TDK Corporation has introduced the TDK-Lambda TPS4500 single- or dual-output industrial power supplies with a 4500W rating.

December 19, 2025 - Hackensack, NJ - Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a ...