The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Are you designing a board with high-speed chipsets on either end of the link? You own the interconnect—and the risk. As clock and data rates climb, maintaining signal integrity becomes critical for ...

AI transforms RF engineering through neural networks that predict signal behavior and interference patterns, enabling proactive system optimization and enhanced performance. The convergence of machine ...

Signal Integrity Infrastructure (SII) is a substrate-level architecture designed to preserve coherence, ethical alignment, and interpretability across synthetic systems. It is not a platform, it is a ...

As data rates soar into the multi-gigabit range, high-speed digital (HSD) PCB design is no longer just about connecting the dots. Signal integrity (SI) and power integrity (PI) challenges can silently ...

The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...

Abstract: Signal integrity analysis permits circuit designers to model and evaluate high-speed I/O with fast simulations, both for quick evaluation of design alternatives and accurate high-level ...

Today’s connected HVAC systems rely on precise data exchange to drive performance, efficiency, and user comfort. From smart thermostats to predictive diagnostics and automation platforms, maintaining ...

The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most ...