Solidworks and Inventor receive a lot of attention, and so we tend to forget the surprising number of other MCAD programs ...

Abstract: A novel chip stacking method with low thermal resistance for 3D integration of a large number of memory chips and processor chips is proposed, namely Massive Orthogonal Stacking Assembly of ...

Once dominated by high-end laser trackers and fixed CMMs capable of sub-micron precision but often limited in flexibility, the portable scanning market has now emerged as a credible counterpart, ...

Leveraging the power of automation for more connected, efficient, smarter sheet metal operations, Lantek launches v.45 of its ...

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