在现代工业设计和工厂建设中，管道系统设计复杂且繁琐，尤其是大型管道设备、生产线或工厂改造项目。传统设计流程往往需要在多个软件之间频繁切换，不仅效率低，还容易出现设计错误。 那么如何高效解决传统设计流程所带来的问题呢？SOLIDWORKS + Smap3D为 ...

Abstract: 3D physical design needs accurate device model of through-silicon vias (TSVs). In this paper, physics-based electrical-thermal model is introduced for both signal and dummy thermal TSVs with ...

Abstract: Planar array electrical capacitance tomography (ECT) has an attractive prospect for underground detection of non-metallic materials, e.g., landmine and subsurface cavity detection. Accurate ...

Beginning our series on the latest EW BrightSparks of 2025, we profile Jadesola Adeleka, of Loughborough University and a ...