Understanding the thermal performance of integrated circuits, whether they are microcontrollers, FPGAs, or processors, has always been essential to avoid the overheating that can cause circuit ...

Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications Designers of advanced IC packages face many ...

Understanding the thermal performance of integrated circuits, whether they are microcontrollers, FPGAs, or processors, has always been essential to avoid the overheating that can cause circuit ...

The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design ...

NASA Langley Research Center (LaRC) is hereby soliciting information with regard to potential sources for support to the Systems Analysis and Concepts Directorate (SACD). A complete systems design and ...

[This article was first published in Army Sustainment Professional Bulletin, which was then called Army Logistician, volume 2, number 2 (March–April 1970), pages 4–8.] IN AN AGE when weapon system ...