Cadence's Chiplet Spec-to-Packaged Parts ecosystem reduces engineering complexity and accelerates time to market for customers developing chiplets targeting physical AI, data center, and HPC ...

At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data centre and HPC (high performance computing). In Las Vegas, Cadence announced ...

Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform SAN JOSE, Calif. -- Cadence ...

Taejoong Song, Vice President of Foundry Technology Planning, Samsung Electronics “As a long-time Cadence partner, we’re pleased to deepen our collaboration through the Chiplet Spec-to-Parts ...