Abstract: With the rapid growth of advanced packaging technology, the task of conducting metrology and defect analysis on new packaging structures becomes more complex and demanding. This paper will ...

Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...

├── configs/ │ └── pointpillars.yaml │ ├── datasets/ │ └── nuscenes_dataset.py │ ├── models/ │ ├── pointpillars.py │ ├── pillar_encoder.py │ └── losses.py │ ├── utils/ │ ├── voxelization.py │ ├── ...