Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Keep all your embroidery thread organized with this easy to make fabric book with plastic bag dividers. How do you store your embroidery thread? For years, mine has been jumbled all together in a ...

Abstract: Chiplets and 2.5D/3D integration schemes allow performance and yield beyond monolithic approaches. This tutorial covers advanced packaging technologies and the new capabilities they enable.

Learn how to master the Brother SE1900 with this comprehensive embroidery and sewing tutorial! From basic setup to advanced stitching techniques, unlock the full potential of your machine and create ...

Strategic research consultancy 5D has announced the launch of a new division, 5D-AI, designed to revolutionise the way businesses leverage insights from data. The new division will be run by 5D ...

Antonia Haynes is a Game Rant writer who resides in a small seaside town in England where she has lived her whole life. Beginning her video game writing career in 2014, and having an avid love of ...

Anthony is a writer who's worked in the games industry for four years. He's a competitive gamer with a soft spot for retro titles. Anthony enjoys speedrunning a few titles, but Simpson's Hit & Run is ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...

From daily news and career tips to monthly insights on AI, sustainability, software, and more—pick what matters and get it in your inbox. Explore The Most Powerful Tech Event in the World with ...

随着半导体行业的快速发展，先进封装技术成为了提升芯片性能和功能密度的关键。 近年来，3.5D封装技术逐渐走向前台，作为2.5D和3D-IC技术之间的一种折中方案，3.5D封装结合了两者的优势，并在解决散热、噪声和信号完整性等方面展现出了独特的能力，技术的 ...