红板报 on MSN
英伟达“Rubin”平台遇阻 HBM4规格升级导致量产延迟
【CNMO科技消息】1月8日,TrendForce集邦咨询的最新调查报告显示,英伟达2025年第三季对其即将推出的Rubin平台(第三代GPU架构)的HBM4存储技术规格进行了上调。此次调整将对HBM(高带宽存储器)单针速率的要求提高至高于11Gbp ...
钛媒体APP on MSN
HBF、HMC等四大存储,谁能力敌HBM
在性能参数方面,HBM4堆栈采用2048位接口,较此前1024位接口实现翻倍,这是自2015年HBM技术问世以来的最大突破;而SPHBM4则将单堆栈接口位数降至512位,通过提升工作频率与采用4:1串行化技术,实现了与HBM4相当的数据传输速率,同时放宽了有机基板所需的凸点间距,降低了封装难度。更重要的是,有机基板布线赋予SPHBM4更长的SoC到内存通道支持能力,使其能够通过增加堆栈数量进一步提 ...
据行业研究机构TrendForce集邦咨询最新发布的市场调研报告显示,存储芯片市场正经历新一轮价格波动周期。受AI服务器需求激增的驱动,全球主要DRAM制造商正加速向先进制程迁移产能,并将新增产能优先分配至服务器和HBM(高带宽内存)领域。这一战略调整导致常规DRAM产品供应出现显著缺口,预计2026年第一季度整体合约价格将环比上涨55%至60%。 在NAND Flash市场,头部厂商持续实施产能 ...
HBM memory, the critical memory component for proper AI development and application, has experienced an existential demand crisis in 2025. Analysts estimate the peak of the crisis won’t be seen until ...
The number of AI inference chip startups in the world is gross – literally gross, as in a dozen dozens. But there is only one that is funded by two of the three biggest makers of HBM stacked memory ...
A total addressable market is a forecast of what will be sold – more precisely, what can be manufactured and sold. It is not a forecast of aggregate demand, which can be even larger as the backlogs ...
Learn how to use advanced techniques like short-circuiting, parallel execution, virtual threads, and stream gatherers to maximize Java stream performance. My recent Java Stream API tutorial introduced ...
Micron Technology (NASDAQ:MU) has shown remarkable performance, with its stock rising approximately 170% year-to-date, establishing it as a prominent player in the semiconductor sector. This surge is ...
Micron Technology (MU) has risen as a top name among memory stocks due in part to its position in the DRAM and HBM markets, which are experiencing elevated pricing and demand. This prompted the ...
Hudbay Minerals Inc. (NYSE:HBM) is one of the best copper stocks to buy right now. On November 24, BofA lifted the price target on Hudbay Minerals Inc. (NYSE:HBM) $21.50 from $19.50 while keeping a ...
TL;DR: Samsung is shifting DRAM production from HBM3/E modules to high-margin DDR5 RDIMM memory due to intense HBM market competition and soaring DDR5 prices. This strategy reallocates 80,000 wafers ...
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