The 250th birthday of the United States will bring many celebrations this year, both patriotic and artistic. One of the most ...

Abstract: This study presents the latest advancements in high-density wafer-level connectivity. We achieve face-to-face hybrid bonding at 250nm pitch. Access from the wafer backside is demonstrated ...

Abstract: As unmanned aerial vehicles (UAVs) become more prevalent in smart cities, their capacity for visual language navigation (VLN) is garnering increasing interest. VLN in cities has significant ...