IEEE

Thermal Management of Heterogeneously Integrated HBM-GPU Module with Step Height Difference

Abstract: System-level thermal solutions of a 2.5-D integrated HBM-GPU with die height variance are analyzed in this paper. The growing geometrical complexity of multi-chip architectures and the ...
IEEE

Design of a 650V Full-Bridge GaN Module with Integrated Gate Driver and Decoupling Capacitors

Abstract: This work presents the design of a Full-Bridge power module with three parallel 650 V, 150 A GaN dies per switch. A wire bond free planar interconnect structure is used for the module design ...