Abstract: The microwave power transfer (MPT) system requires a massive Tx array for building a focused radio wave to efficiently transfer power to the Rx. Beamforming IC is one of the core elements ...

This library implements the ICOM CI-V CAT protocol emulating an IC-746 transceiver. The library has been tested on a homebrew transceiver of my creation. It has been demonstrated to work with an ...

Abstract: This paper describes a new custom IC optimised for online Electrochemical Impedance Spectroscopy (EIS) characterisation of battery packs at the cell-level, with 200 mA peak perturbation ...

Inflation has increased by almost 371% since 1996, but with the recent surge in food prices, R100 tends to buy you less than it should in 2025 compared to 29 years ago. Inflation in South Africa is ...

World experts explore how cultural institutions adapt to fast-changing societies The conference provided an unprecedented platform for exchange, learning, and collaboration across the global museum ...

Far from being mere repositories for arts and artefacts, museums are society’s looking glass. They are a reflection of its collective memory and, at times, even its conscience. Now, as the world is in ...

The ICOM Dubai Organising Committee is set to host the 27th General Conference of the International Council of Museums (ICOM), the world’s largest global gathering of museum professionals, from 11 to ...

Idaho State University is publicly pushing the idea of buying a private, for-profit medical school in Meridian — while the owners are keeping quiet. The owners declined to answer any questions about ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

One of the largest emission nebulae in the far northern sky can be found in IC 1396, a bright glow in Cepheus that contains several complex objects. Among them are the red supergiant star Mu Cephei; ...

A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...