Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.

Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...

We introduce VeriStruct, a novel framework that extends AI-assisted automated verification from single functions to more complex data structure modules in Verus. VeriStruct employs a planner module to ...