Penguin Solutions, Inc. (Nasdaq: PENG) a provider of high-performance computing and AI infrastructure solutions, today - Read ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

SEOUL, South Korea, Dec. 7, 2022 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has developed working samples of DDR5* Multiplexer Combined Ranks (MCR) Dual ...

New M.2 module powered by MemryX MX3 delivers 24 TOPS of high-efficiency AI performance for vision applicationsRANCHO SANTA ...

Micron Technology, Inc. has announced that it is the first and only memory company to ship both HBM3E and SOCAMM products for AI servers in data centers, reinforcing its leadership in low-power memory ...

The ISP2454-LX family from Insight SIP is a Bluetooth Low Energy module platform built on Nordic Semiconductor’s nRF54L15 SoC ...

Corsair has announced the immediate release of its VENGEANCE RGB DDR5 CUDIMM memory kits, offering capacities up to 96 GB and initial frequencies of 9,200 MT/s, with higher-speed variants forthcoming.

South Korean memory chip supplier SK hynix said Tuesday it has shipped the world's fastest DRAM module under the double data rate 5 standard, considered a next-generation memory technology. SK hynix ...

Samsung Electronics is set to commence mass production of 256GB CXL 2.0 memory modules using 1y nm DRAM by the end of 2024. This announcement was made by Choi Jang Seok, head of the new business ...

Samsung says AI-driven memory chip shortages are pushing up electronics costs and could lead to higher prices for consumer devices.

The memory shortage caused by AI companies has resulted in HP having to turn to Chinese memory manufacturers as a possible source for supply.