Abstract: This study presents an innovative approach to early detection of wire bond lift-off failures in power semiconductor modules (PSMs) using an integrated on-chip temperature sensor. Despite ...

We tested popular wideband O₂ controllers against lab-grade equipment to see how accurate their lambda readings really are ...

Abstract: Wire retention force is an important indicator for evaluating the reliability of wire insertion in electrical connectors. Current approaches to measure this force are mainly relied on spring ...