Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ architecture vehicles. The ...

The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...

Apple’s semiconductor roadmap is poised for a major breakthrough in 2026 with the introduction of the A20 Pro chip.

Penguin Solutions, Inc. announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has successfully ...

(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...

SemiBlocks showcases their revolutionary SCXO timing module for 5G, atomic clocks and Positioning, Navigation & Timing (PNT) ...

Apple's iPhone Fold and iPhone 18 Pro will debut this September with the groundbreaking A20 Pro chip, featuring crease-free displays, 30% greater energy efficiency and revolutionary WMCM packaging ...

Schaeffler noted that several systems reflected the integration of software assets gained through its acquisition of Vitesco ...

Apple's foldable iPhone will share the same next-generation A20 Pro chip as the iPhone 18 Pro and iPhone 18 Pro Max models ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices ...

According to supply-chain analyst Jeff Pu, Apple is positioning the iPhone Fold for a September 2026 launch, coinciding with the unveiling of the iPhone 18 Pro and iPhone 18 Pro Max. This strategic ...