As part of the Principles of Manufacturing MicroMasters program, this course will build on statistical process control foundations to add process modeling and optimization. Building on formal methods ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Vacuum degassing processes in low carbon steel production improve material properties, with real-time gas analysis critical for maintaining quality standards.