A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging” was published by researchers at Sungkyunkwan ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

Abstract: The report presents approach to reduce PCB distortion after heat treatment for soldering using a reflow process. The influence of the temperature profile at different heating of the lower ...

Looking back at the history of PCBs, high-density PCB design approaches were based on the same methodologies used in integrated circuit (IC) substrates. These methods were developed prior to ...

Abstract: In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB ...

A process for fine pitch bumping involving vacuum and formic acid reflow (VFAR) suitable for high volume manufacturing is described. A joint study between Heller Industries ... In 2022 Heller's ...

The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...

Reflow Process Index is designed to provide maximum quality and throughput from SMT reflow ovens. Helps manage reflow ovens to consistently maximize desired results. Provides process deficiency ...