Abstract: In this study, a three-dimensional spin coating model has been built up to simulation the flow formation process of Lagrange droplets in photoresist coating process. Numerical calculation ...

Abstract: The capillary underfill (CUF) process is an extensive application in electronic devices, and still remains an active research subject, especially in underfill material research. In this ...

Failure to register for counselling within the given timeline may result in forfeiture of admission, even after qualifying the exam. The declaration of the CLAT 2026 result marks a crucial step for ...