The world’s leading chip companies came to CES 2026 this week with some major announcements that will give channel partners a ...
AMD Ryzen AI Embedded Processor. News Highlights. New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 G ...
In telecommunication applications, target impedance serves as a crucial benchmark for power distribution network (PDN) design. It ensures that the die operates within an acceptable level of rail ...
Abstract: Ball Grid Array (BGA) packages are increasingly adopted in high reliability electronics equipment. The main reliability concern is that lead-free (Pb-free) packaged BGAs bring the risks of ...
Top Manufactures in Ball Grid Array (BGA) PCB Market research reports are as follow: Samsung Electro-Mechanics, Nanya PCB, TTM Technologies Inc., Unimicron, Shennan ...
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Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...